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TechNexion - Embedded Vision
XProduct SKU: TEK6040-ORIN-NANO
Core System
Processor NVIDIA® Jetson Orin Nano™ Architecture 6-core Arm® Cortex®-A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 AI / ML 40 TOPS Memory 8GB 128-bit LPDDR5 68 GB/s Storage NVMe via M.2 Key M2242 or M2280 System on Module Jetson Orin Nano 8GBVideo
GPU Engine 1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores Video decode 11x 1080p30 (H.265),1x 4K60 (H.265), 2x 4K30 (H.265),5x 1080p60 (H.265) Video encode 1080p30 supported by 1-2 CPU coresEnvironmental and Mechanical
Enclosure Material Anodized Aluminium Dimensions 168 (W) x 150 (D) x 55 (H) mm Weight 960 grams Relative Humidity 10 to 90 % Shock 30G half-sine 11 ms duration Operation Temperature Industrial: -20°C to +50°C Vibration 3 Grms random 5-500Hz hr/axisCertification and Compliance
Certification Compliant with CE / FCC / RoHS / REACH directives More Weight 960 gSpecifications
Nvidia Jetson Orin Nano 1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores 40 TOPS AI Performance Gigabit Ethernet and USB 3 UART, CAN, GPIO I/O 8 FPD-Link III Camera supported Comes with Nvidia Jetpack Software pre-installed VizionViewer SDK for easy camera controlCONTACT US FOR VOLUME PRICING
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Teledyne Relays - CENTRIGRID DPDT 12VDC
XProduct SKU: 172-12-P
Centigrid hermetically sealed package, through-hole or surface mountable (SMT-J), non-latching DPDT Available options include: 172D - coil transient suppression diode Resistive: 1 Amp/28Vdc Inductive: 200 mA/28Vdc (320 mH) Lamp: 100 mA/28Vdc
Features
- All welded construction.
- Unique uni-frame design providing high magnetic efficiency and mechanical rigidity.
- High force/mass ratios for resistance to shock and vibration.
- Advanced cleaning techniques provide maximum assurance of internal cleanliness.
- Precious metal alloy contact material with gold plating, assures excellent high current and dry circuit switching capabilities.
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Teledyne Relays - CENTRIGRID DPDT 5VDC
XProduct SKU: 172-5-P
CENTIGRID® COMMERCIAL RELAYS DPDT
DESCRIPTION
The 172 Centigrid® relay is an ultraminiature, hermetically sealed, armature relay for commercial applications. Its low profile height (.280”) and .100” grid spaced terminals, which preclude the need for spreader pads, make it an ideal choice where extreme packaging density and/or close PC board spacing are required.
The basic operating concept and internal structure are similar to Teledyne’s DPDT 114 Centigrid® relay. Unique construction features and manufacturing techniques provide overall high reliability and excellent resistance to environmental extremes.
Features
The 172 feature:
- All welded construction.
- Unique uni-frame design providing high magnetic efficiency and mechanical rigidity.
- High force/mass ratios for resistance to shock and vibration.
- Advanced cleaning techniques provide maximum assurance of internal cleanliness.
- Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities.
The Series 172 relay has an internal discrete silicon diode for coil transient suppression.
By virtue of its inherently low intercontact capacitance and contact circuit losses, the 172 relay is an excellent subminiature RF switch for frequencies well into the UHF spectrum. Applications include telecommunications, test instruments, mobile communications, attenuators, and automatic test equipment.
Specifications
ENVIRONMENTAL AND PHYSICAL SPECIFICATIONS
- Temperature (Ambient): $$-65^{circ}C$$ to $$+125^{circ}C$$
- Vibration (Note 1): 10 g's to 500 Hz
- Shock (Note 1): 30 g's, 6 ms, half sine
- Enclosure: Hermetically sealed
- Weight: 0.15 oz. (4.3g) max.
- Reflow Temperature: 260°C max. temp. 1 min. max
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Teledyne Relays - RF303 T05 DPDT RELAY 5VDC
XProduct SKU: RF303-5
Features
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Teledyne Relays - TO-5 RELAY NON LATCHING DPDT
XProduct SKU: 712-12-P
TO-5 hermetically sealed package, through-hole mounted, non-latching DPDT
Available options include:
- 712D - coil transient suppression diode
- 712TN - coil transient suppression diode, and transistor driver
Resistive: 1 Amp/28Vdc
Inductive: 200 mA/28Vdc/320 mH
Lamp: 100 mA/28Vdc
Features
The 712 series feature:
- All welded construction.
- Unique uni-frame design providing high magnetic efficiency and mechanical rigidity.
- High force/mass ratios for resistance to shock and vibration.
- Advanced cleaning techniques provide maximum assurance of internal cleanliness.
- Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities.
The Series 712D relay has an internal discrete silicon diode for coil transient suppression. The hybrid Series 712TN relay has an internal silicon diode and transistor driver. The integrated packaging of the relay with its associated semiconductor devices greatly reduces PC board floor space requirements as well as component installation costs.
By virtue of its inherently low intercontact capacitance and contact circuit losses, the 712 has proven to be excellent ultraminiature RF switch for frequency ranges well into the UHF spectrum. A typical RF application for the TO-5 relay is in handheld radio transceivers, wherein the combined features of good RF performance, small size, low coil power dissipation and high reliability make it a preferred method of Transmit-Receive switching.
Specifications
ENVIRONMENTAL AND PHYSYSICAL SPECIFICATIONS
| Temperature (Operating) | Vibration (Note 1) | Shock (Note 1) | Enclosure | Weight | Reflow Temperature |
|---|---|---|---|---|---|
| -55°C to +85°C | 10 g's to 500 Hz | 30 g's, 6 ms half sine | Hermetically sealed | 0.09 oz. (2.55g) max. | 260°C max. temp. 1 min. max |
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