Wireless
Showing 199–216 of 306 results

Microchip - BM83
XProduct SKU: BM83SM1-00AB-P
Overview coming soon - Call 01527 830800 for information
Features
Bluetooth 5.0 certified HFP 1.7 (HF Unit Role Only), HSP 1.2, A2DP 1.3 (Source and Sink), SPP 1.2, AVRCP 1.6, PBAP 1.2 Supports Bluetooth classic (BR/EDR) and Bluetooth Low Energy (BLE) General Attribute Profile (GATT) and General Access Profile (GAP) AAC and SBC decoding Bluetooth Low Energy Data Length Extension (DLE) and secure connectionFrom£6.95 (Ex. VAT)
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Microchip - LoRa Module WLR089U0
XProduct SKU: WLR089U0-I/RM

The WLR089U0 module is an ultra-low power, regulatory certified LoRa module based on the ATSAMR34J18 LoRa IC. This standalone module includes a 32-bit ARM® Cortex®-M0+ processor and offers 256KB of Flash and 40KB of SRAM (8KB battery backed) in a compact 17 x 13.5 mm package. With ultra-low power sleep currents as low as 790nA, the WLR089U0 modules are ideal for battery powered remote sensor applications. The highly configurable module peripherals include up to 4 SERCOMs (configurable as I2C/SPI /UART/LIN interfaces) with one in the low power domain, 7 12-bit ADC channels and 2 analog comparators. The module supports LoRa, FSK, MSK and OOK modulations and delivers up to 18.6 dBm TX power with an RX sensitivity down to -136 dBm. The module operates from 863 to 928 MHz and is FCC, IC and RED certified. Supported by WLR089 Xplained Pro Evaluation Kit (EV23M25A), Atmel Studio and a detailed module reference design package, these modules highly simplify the development and accelerate the time to market for LoRa end-nodes.
Features
- Ultra-low power LoRa Module - Based on highly integrated, ultra-low power SAM R34/35 LoRa family - Standalone module with 256 KB flash and 40KB RAM - 863 to 928 MHz dual-band coverage - Compact surface mount module : 17 mm x 13.5 mm size - FCC, IC and RED certifiedSpecifications
The highly configurable module peripherals include up to 4 SERCOMs (configurable as I2C/SPI /UART/LIN interfaces) with one in the low power domain, 7 12-bit ADC channels and 2 analog comparators. The module supports LoRa, FSK, MSK and OOK modulations and delivers up to 18.6 dBm TX power with an RX sensitivity down to -136 dBm. The module operates from 863 to 928 MHz and is FCC, IC and RED certified. Supported by WLR089 Xplained Pro Evaluation Kit (EV23M25A), Atmel Studio and a detailed module reference design package, these modules highly simplify the development and accelerate the time to market for LoRa end-nodes.From£10.55 (Ex. VAT)
1011 In stock
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Microchip - LoRa RN2483 Evaluation Kit
XProduct SKU: DM164138

The RN2483 is a fully-certified 868 MHz module based on wireless LoRa® technology. The RN2483 utilizes a unique spread spectrum modulation within the Sub-GHz band to enable long range, low power, and high network capacity. The module's embedded LoRaWAN protocol enables seamless connectivity to any LoRaWAN compliant network infrastructure, whether public or privately deployed. The module is specifically designed for ease of use, which shortens development time and speeds time to market. LoRa technology is ideal for battery-operated sensors and low power applications such as IoT, M2M, Smart City, Sensor networks, Industrial automation, and more. The RN2483 is the first LoRa module to pass LoRa Alliance Certification testing. It is certified to the LoRaWAN 1.0.1 specification, ensuring that designers can quickly and easily integrate their end devices into any LoRaWAN network. Firmware Versions RN2483A-I/RM104 - LoRaWAN Specification 1.0.1, Ideal for Class A applications, Regulatory and LoRaWAN certified RN2483A-I/RM105 - LoRaWAN specification 1.0.2, Supports both Class A and Class C, Regulatory certified Microchip's complimentary and confidential Wireless Check online design review service is available for customers who have selected our products for their application design-in*. *The online design review service is subject to Microchip's Program Terms and Conditions and requires a myMicrochip account.
Features
Additional Features
- On-board LoRaWAN protocol stack - ASCII command interface over UART - Compact form factor 17.8 x 26.7 x 3 mm - Castellated SMT pads for easy and reliable PCB mounting - Device Firmware Upgrade (DFU) over UART - 14 GPIO for control, status, and ADC - Highly integrated module with MCU, crystal, EUI-64 Node Identity Serial EEPROM, Radio transceiver with analog front end, and matching circuitry - Environmentally friendly, RoHS compliant - European R&TTE Directive Assessed Radio ModuleFrom£84.35 (Ex. VAT)
4 In stock
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Microchip - MCHP_BM70_BLE_module
XProduct SKU: BM70BLES1FC2-0B04AA
M70 Bluetooth Low Energy module is designed for easy implementation into a broad range of applications. It delivers up to 2.5x throughput improvement and more secure connections vs. Bluetooth 4.1 based products. Developers can easily interface to the device via a standard UART interface, available on most Microcontrollers and Processors. The BM70 has a completely integrated Bluetooth software stack, and offers a shielded regulatory certified version with built-in antenna. Developers are freed from the complexities of Bluetooth Software and RF development and can simply utilize the BM70 as a wireline replacement. Perfect for IoT (Internet of Things) applications, when interfaced to a BLE enabled smartphone or Bluetooth Internet Gateway, applications can be monitored, controlled and updated from anywhere in the world.
Features
- Bluetooth 5 Certified - Module certified for use in USA, Canada, -Europe, Japan, Korea, Taiwan and China -Mobile Application supported in Microchip - Bluetooth Data (MBD) - Latest Firmware Revision: 1.11 - (BM70BLEx1FC2-0B04AA) - Supports LE Secure Connections levels 1-3 - UART interface - 3 x PWM supported - Main Crystal : 32MHzSpecifications
Firmware Release Summary, : BM70BLEx1FC2-0B05BA - FW 2.03 is a maintenance release for IS1870, IS1871, BM70, and BM71. Firmware version 2.0.3 adds new features/ removes limitations in previous release 1.11 and fixes Sweyntooth vulnerability. BM70BLEx1FC2-0B04AA - FW 1.11 - Fixes bug with invalid Bluetooth address. Refer to Errata document for more information. BM70BLEx1FC2-0B03AA - FW 1.06 - Added support for the BM71 among other bug fixes. BM70BLEx1FC2-0002AA - FW 1.03 - Initial Release.CONTACT US FOR VOLUME PRICING
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Microchip - MCP3914
XProduct SKU: ADM00523
The MCP3914 ADC Evaluation Board for 16-Bit MCUs system provides the opportunity to evaluate the performance of the MCP3914 eight-channel AFE. It also provides a development platform for 16-bit PIC® based applications, using existing 100-pin PIC microcontroller Plug-in Module (PIM) systems that are compatible with the Explorer 16 and other high pin count PIC® based demo boards. The system comes with a programmed PIC24FJ256GA110 PIM module that communicates with the Energy Management Utility software for data exchange and ADC setup via a USB connection to the board.
From£175.00 (Ex. VAT)
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Microchip - PIC32 WFI32E Curiosity Board
XProduct SKU: EV12F11A
Overview coming soon - Call 01527 830800 for information
Features
WFI32E01PC, a PIC32MZ W1 Wi-Fi Module with PCB antenna and Trust&Go hardware security enabled MikroBUS™ socket to expand functinality using MikroElectronika ClickTM adapter boards PICkitTM On Board Universal Serial Bus (USB) Micro-B Socket for programming/debugging On-board LEDs and user configurable buttons On-board temperature sensor On-board Ethernet PHY header On-board GPIO header (24 pins) On-board XPRO header The Curiosity Board are able to connect to QT7 Xplained Pro Extension Kit (atqt7-xpro) development board. ICSPTM header On-board 32 Mbit External SPI Flash MemoryFrom£92.25 (Ex. VAT)
10 In stock
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Microchip - RNBD451 Add On Board
XProduct SKU: EV25F14A
5 In stock
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Microchip - WLR089 LoRa Module & Evaluation Board
XProduct SKU: EV23M25A

The WLR089 Xplained Pro is a hardware platform designed to evaluate the WLR089U0 LoRa modules. The WLR089U0 modules are FCC, IC and RED certified. The WLR089 kit is not only an evaluation platform but also an excellent reference design for developing SAMR34/35 based LoRa end-node applications. This kit is supported by the Atmel Studio, an integrated development platform, which provides predefined application examples. The kit also provides easy access to various features of the WLR089U0 module and ATSAMR34J18B device and offers additional peripherals to extend the features of the board and ease the development of custom designs.
Features
Features ultra-low power WLr089U0 LoRa module with support for 862 - 1020 MHz. Dual-mode Frequency Operation On-board debugger (EDBG) eliminates the need for external debugger Two extension headers for signal breakout and expansion boards On-board power management system with current monitoring XPRO current measurement system data visualizer support On-board TCXO for optimal performance at long range External Whip Antenna with u.FL included Manual Reset Button and GPIO Button Indicator LEDs for Status and Power Auxiliary 10-Pin Cortex Programming Header Supported by Studio 7 Integrated Development Platform and software examples in Advanced Software Framework (ASF)From£115.25 (Ex. VAT)
2 In stock
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Microchip RN4871 BLE
XProduct SKU: RN4871-V/RM140
502 In stock
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NBIOT Wireless Sensor
XProduct SKU: NBIOT-TEMPSENSOR-DEV-KIT-P
Overview coming soon - Call 01527 830800 for information
Features
TEMPERATURE SENSOR Range: -35° to 70°C Accuracy up to 0.25°C in the -20°C to +70°C range and 0.5°C in the -35°C to -20°C range Resolution: 0.1°C Drift: <0.1°C / year Measurement interval: 1 minute to 10 days, configurable Memory size: 60 000 measurements NB-IoT NB-IoT band: 8, 20 3GPP: Release 13 Power: 20 dBm BLUETOOTH LE Radio module frequency: 2,4 GHz Power: 2,5 mW (4 dBm) Range: up to 100 m (LOS) Transmision period: 1 s COMMUNICATION Protocol: CoAP; Trasnsmission interval: 5 minutes - 10 days, configurable SOFTWARE UPDATES Over the air (with delta mechanism); Over Bluetooth Low Energy BATTERY Battery: 2 x AA 3,6 V, capacity 4 200 mAh (replaceable) Battery operating time: up to 10 years DIMENSIONS 27 x 71 x 71 mm Weight: 100 gFrom£140.00 (Ex. VAT)
1 In stock
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Pulse Electronics ISM Chip Antennas
XProduct SKU: W3013

Features:
• Frequency 866-870 MHz • Gain 1.5dBi • Size 10 x 3.2 x 4 mm • PCB Keep out 10.8 x 8.25mm • Polarization Linear • Radiation pattern Omni • ISM 868MHz BanCONTACT US FOR VOLUME PRICING
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Quectel EG25GGB MINIPCIE CAT4
XProduct SKU: EG25GGB-MINIPCIE-S
152 In stock
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Quectel Wireless Solutions - 5G EVB kit for Quectel 5G modules
XProduct SKU: 5GEVBKIT

The EVB is an auxiliary tool for engineers to develop and test the following modules:-
5G Modules
RG500Q series, RG501Q-EU, RG502Q series, RG520F series, RG520N series,
RG525F-NA, RG530F series, RG200U series, RG500U series
LTE-A Modules
EG512R-EA
From£149.99 (Ex. VAT)
3 In stock
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Quectel Wireless Solutions - BG600L LPWA Module
XProduct SKU: BG600LM3AA-D08-SGNSA

Quectel BG600L-M3 LTE Cat M1/Cat NB2/EGPRS Module The BG600L-M3 module is multi-mode LPWA that supportis LTE Cat M1/Cat NB2/EGPRS and integrated GNSS. BG600L-M3 is 3GPP Rel. 14 compliant, offering maximum data rates of 588 kbps downlink and 1119 kbps uplink under LTE Cat M1. Featuring Ultra-Low power consumption by leveraging the integrated RAM/flash and the ARM Cortex A7 processor supporting ThreadX, achieving up to 70% reduction in PSM leakage and 85% reduction in eDRX current consumption compared to its predecessor. BG600L-M3 possesses an extensive set of hardware-based security features and allows trusted applications to run directly on the Cortex A7 TrustZone engine. In addition, BG600L-M3 is compatible with Quectel GSM/GPRS/GNSS module MC60, which provides a fitting solution for customers when network migrating.
Features
- LTE Cat M1/Cat NB2/EGPRS Module that has ultra-low power consumption
- Allows for easy migration from Quectel GSM/GPRS/GNSS module MC60
- Support VoLTE* for LTE Cat M1 and CS voice* for GSM
- Integrated RAM and flash in the baseband chipset
- Comprehensive set of hardware-based security features
- Compact SMT form factor ideal for size-constrained applications
- Robust mounting and interfaces
From£18.71 (Ex. VAT)
54 In stock
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Quectel Wireless Solutions - BG770A LTE Cat M1/Cat NB2 Module
XProduct SKU: BG770AGLAA-N06-SGNSA-P

The BG77xA-GL is a series of LPWA modules with an SMT form factor of 14.9mm × 12.9mm × 1.9mm and integrated GNSS engine, which supports LTE Cat M1 and LTE Cat NB1/NB2 bands. The module is fully compliant with the 3GPP Rel-14 specification and provides global carrier band combinations. It features a Cortex M4 MCU for user applications and ultra-low power consumption by leveraging the integrated RAM and flash to achieve extremely low current consumption in various standby/hibernation modes, including 3GPP PSM and e-I-DRX. In addition, the BG77xA-GL contains a GNSS and cellular-based location engine that supports GPS and GLONASS. The BG77xA-GL boasts a comprehensive hardware based security feature – Integrated Security Elements (ISE). The ultra-compact form factor and high integration level of the module enables integrators and developers to easily design their applications and take advantage of low-power consumption and mechanical intensity. The BG77xA-GL’s advanced LGA package allows for fully automated manufacturing required for high-volume applications. A rich set of Internet protocols, industry-standard interfaces and abundant functionalities extend the applicability of the module to a wide range of IoT applications, such as wireless POS, smart metering, tracking, wearable devices, and many more.
Features
- Integrated RAM and flash - Embedded with abundant Internet service protocols - Ultra-low power consumption - Support for DFOTA - Supports iSIM (BG773A-GL only) - Rich set of external, multi-band interfaces that ensure convenient applications - Fast time-to-market: reference designs, evaluation tools and timely technical support minimize design in time and development efforts - Robust mounting and interfacesFrom£9.99 (Ex. VAT)
5 In stock
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Quectel Wireless Solutions - BG77LA LTE Cat M1/Cat NB2 Module
XProduct SKU: BG77LA-64-SGNS

Quectel BG77 Ultra-Compact LTE Cat M1/Cat NB2 Module Quectel BG77 is an ultra-compact LPWA module that supports LTE Cat M1, LTE Cat NB2 and integrated GNSS. It is also completely compliant with 3GPP Rel-14 specification and provides maximum data rates of 588 kbps downlink and 1119 kbps uplink. Also featuring ultra-low power consumption by leveraging the integrated RAM/flash as well as the ARM Cortex A7 processor supporting ThreadX, achieving up to 70% reduction in PSM leakage and 85% reduction in eDRX current consumption compared to its predecessor. BG77 boasts a comprehensive set of hardware-based security features and enables trusted applications to run directly on the Cortex A7 TrustZone engine. With an ultra-compact SMT form factor of 14.9 mm × 12.9 mm × 1.7 mm and high integration level, it enables integrators and developers to easily design their applications and take advantage from the module’s low power consumption and mechanical intensity.
From£16.99 (Ex. VAT)
3189 In stock
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Quectel Wireless Solutions - BG95M3LA LTE Cat M1& NB2 EGPRS Module
XProduct SKU: BG95M3LA-64-SGNS-P

The BG95 is a series of multi-mode LPWA modules supporting LTE Cat M1/Cat NB2/EGPRS and integrated GNSS. It is 3GPP Rel-14 compliant and offers maximum data rates of 588kbps downlink and 1119kbps uplink under LTE Cat M1. It features ultra-low power consumption by leveraging the integrated RAM/flash as well as the ARM Cortex A7 processor supporting ThreadX, achieving up to 70% reduction in PSM leakage and 85 % reduction in eDRX current consumption compared to its predecessor. The BG95 boasts a comprehensive set of hardware-based security features and enables trusted applications to run directly on the Cortex A7 TrustZone engine. Additionally, the BG95 provides pin-to-pin compatibility with Quectel LTE Cat 4 modules EG91/EG95, LTE Cat M1/Cat NB1/EGPRS module BG96, NB-IoT module BC95-G, UMTS/HSPA modules UG95/UG96 and GSM/GPRS module M95. With a cost-effective SMT form factor of 23.6mm × 19.9mm × 2.2mm and high integration level, BG95 enables integrators and developers to easily design their applications and take advantage from the module’s low power consumption and mechanical intensity. Its advanced LGA package allows fully automated manufacturing for high-volume applications. A rich set of Internet protocols, industry-standard interfaces and abundant functions extend the applicability of the module to a wide range of M2M applications such as wireless POS, smart metering, tracking, wearable devices, etc.
Features
- Easy migration from Quectel GSM/GPRS, UMTS/HSPA and LTE modules - Pin-to-pin compatibility with Quectel LTE Cat 4 modules EG91/EG95, LTE Cat M1/Cat NB1/EGPRS module BG96, NB-IoT module BC95, UMTS/HSPA modules UG95/UG96 and GSM/GPRS module M95 - ARM Cortex A7 processor (supports ThreadX) - Integrated RAM and flash memory in the baseband chipset - USB 2.0 interface - Comprehensive array of hardware-based security features - Supports DFOTA - Supports VoLTE (Cat M1 only), CS voice for GSM, QuecOpen®, eSIM, etc. - Fast time-to-market: reference designs, evaluation tools and timely technical support minimize design and development efforts - Robust mounting and interfaces - Supports nuSIMFrom£18.77 (Ex. VAT)
100 In stock
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Quectel Wireless Solutions - BG95M6LA LTE Cat M1& NB2 EGPRS Module
XProduct SKU: BG95M6LA-64-SGNS

The BG95 is a series of multi-mode LPWA modules supporting LTE Cat M1/Cat NB2/EGPRS and integrated GNSS. It is 3GPP Rel-14 compliant and offers maximum data rates of 588kbps downlink and 1119kbps uplink under LTE Cat M1. It features ultra-low power consumption by leveraging the integrated RAM/flash as well as the ARM Cortex A7 processor supporting ThreadX, achieving up to 70% reduction in PSM leakage and 85 % reduction in eDRX current consumption compared to its predecessor. The BG95 boasts a comprehensive set of hardware-based security features and enables trusted applications to run directly on the Cortex A7 TrustZone engine. Additionally, the BG95 provides pin-to-pin compatibility with Quectel LTE Cat 4 modules EG91/EG95, LTE Cat M1/Cat NB1/EGPRS module BG96, NB-IoT module BC95-G, UMTS/HSPA modules UG95/UG96 and GSM/GPRS module M95. With a cost-effective SMT form factor of 23.6mm × 19.9mm × 2.2mm and high integration level, BG95 enables integrators and developers to easily design their applications and take advantage from the module’s low power consumption and mechanical intensity. Its advanced LGA package allows fully automated manufacturing for high-volume applications. A rich set of Internet protocols, industry-standard interfaces and abundant functions extend the applicability of the module to a wide range of M2M applications such as wireless POS, smart metering, tracking, wearable devices, etc.
Features
- Easy migration from Quectel GSM/GPRS, UMTS/HSPA and LTE modules - Pin-to-pin compatibility with Quectel LTE Cat 4 modules EG91/EG95, LTE Cat M1/Cat NB1/EGPRS module BG96, NB-IoT module BC95, UMTS/HSPA modules UG95/UG96 and GSM/GPRS module M95 - ARM Cortex A7 processor (supports ThreadX) - Integrated RAM and flash memory in the baseband chipset - USB 2.0 interface - Comprehensive array of hardware-based security features - Supports DFOTA - Supports VoLTE (Cat M1 only), CS voice for GSM, QuecOpen®, eSIM, etc. - Fast time-to-market: reference designs, evaluation tools and timely technical support minimize design and development efforts - Robust mounting and interfaces - Supports nuSIMSpecifications
Multi-band LPWA module 51.0mm × 30.0mm × 4.9mm SMT form factor Mini PCIe package Max. 588Kbps downlink / 1119Kbps uplink under LTE Cat M1 Extended temperature range of -40°C to +80°CFrom£33.49 (Ex. VAT)
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