SBC - 3.5" SBC
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Avalue – 3.5″ 8th Gen Intel® Whiskey Lake
Avalue - 3.5" 8th Gen Intel® Whiskey Lake
XProduct SKU: ECM-WHL
Bottom Layer Soldered -Intel® CoreTM/Celeron® BGA Processor -nItel® UHD Graphics 620/610 -Dual DRAM Socket, Max. Up to 64GB DDR4 2400MHz -Triple Display (Dual HDMI, LVDS)HDMI w/CEC Control (Factory Option) -Dual Expansion Slot, 2-M.2 -Dual Gigabit Ethernet, HD Audio Code -Support TPM 2.0, RAID 0/1
Features
-Intel® Core™ i7-8665UE Processor (8M Cache, up to 4.40 GHz) -Intel® Core™ i5-8365UE Processor (6M Cache, up to 4.10 GHz) -Intel® Core™ i3-8145UE Processor (4M Cache, up to 3.90 GHz) -Intel® Celeron® Processor 4305UE (2M Cache, 2.00 GHz)CONTACT US FOR VOLUME PRICING
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Avalue – ECM-APL Intel® Pentium®/Celeron®/Atom® SoC Processor 3.5”Micro Module
Avalue - ECM-APL Intel® Pentium®/Celeron®/Atom® SoC Processor 3.5”Micro Module
XProduct SKU: ECM-APL
Top Layer SolderedIntel® Pentium®/Celeron®/Atom™ BGA ProcessorIntel® HD Graphics 500/505 Graphic EngineSingle DRAM Socket, Max. Up to 8GB DDR3L 1600&1333MHzTriple Display (Dual HDMI, LVDS)Dual Expansion Slot, M.2 & mPCIeDual Gigabit Ethernet, HD Audio Code0~60C for N & J Series, -40~85C for E SeriesTPM 2.0 (Factory Option)
Features
System Information Processor Intel Atom® x7-E3950 Processor (2M Cache, up to 2.00 GHz) Intel Atom® x5-E3940 Processor (2M Cache, up to 1.80 GHz) Intel Atom® x5-E3930 Processor (2M Cache, up to 1.80 GHz) Intel® Pentium® Processor N4200 (2M Cache, up to 2.50 GHz) Intel® Celeron® Processor N3350 (2M Cache, up to 2.40 GHz) Intel® Celeron® Processor J3455 (2M Cache, up to 2.30 GHz) Platform Controller Hub Apollo SoC integrated System Memory 1 x 204-Pin DDR3L 1600&1333MHz SO-DIMM,supports up to 8GB (Non-ECC) I/O Chipset EC(IT8528E), I-series CPU use EC (IT8528I) for WT BIOS Information AMI uEFI BIOS,128Mbit SPI Flash ROM Watchdog Timer H/W Reset, 1sec. ~ 65535sec. and 1sec./step H/W Status Monitor Monitoring System Temperature, Voltage and FAN Status with Auto Throttling Control Expansion Expansion 1 x Mini PCIe (for PCIe & USB2.0) 1 x M.2 (2242)B-Key Storage Storage 1 x M.2 support SATA/USB interface & with Micro SIM card connector for SSD/3G/4G Touch Screen Built-in Touch controller (optional) EETI ETP-CP-MER4485XRU 1 x 5-pin 2.54mm Pin Header I/O USB Port 1 x USB 2.0 4 x USB 3.0 COM Port 1 x RS-232/422/485 5 x RS-232 GPIO 1 x 8bit GPIO SIM Slot 1 x Micro SIM Card Slot SATA 1 x SATA3 MIO 1 x LPC 1 x SPI Display Graphic Chipset Intel® Apollo Lake SoC integrated Gen9 LP Graphics Spec. & Resolution 2 x HDMI: Max. Resolution 3840x2160 @ 30Hz 1 x LVDS: Max. Resolution 1920x1080 @ 60Hz Multiple Display Triple Display Audio Audio Codec Realtek ALC888S supports 5.1-CH Audio Interface Mic-In, Line-In, Line-Out Certifications Certification Information CE,FCC Class B Ethernet LAN Chipset 2 x Intel® I211AT Intel I210IT for WT Ethernet Interface 10/100/1000 Base-Tx GbE compatible LAN Port 2 x RJ-45 Mechanical & Environmental Operating Temperature 0°C ~ 60°C (32°F ~ 140°F)(N4200/N3350) -40°C ~ 85°C (-40°F ~ 185°F)(E3900 Series)(Optional for Wide Temperature Model) Storage Temperature -40°C ~ 75°C (-40°F ~ 167°F) Operating Humidity 40°C @ 95% Relative Humidity, Non-condensing Weight 0.44lbs (0.2kg) Power Requirement Typical 12/24Vdc (+12V ~ +26V ) Power Mode AT/ATX Dimension (L x W) 5.7" x 4" (146mm x 101mm) Software Support OS Information Win 10, Linux Ordering Information Ordering Information ECM-APL-N4200-C1R 3.5" W/N4200/5USB/6COM/2LAN/C1 ECM-APL-N3350-C1R 3.5" W/N3350/5USB/6COM/2LAN/C1 ECM-APL-J3455-C1R 3.5" W/J3455/5USB/6COM/2LAN/C1 ECM-APL-E50-C1R(0~+60C) 3.5" W/E3950/5USB/6COM/2LAN/C1 ECM-APL-E40-C1R(0~+60C) 3.5" W/E3940/5USB/6COM/2LAN/C1 ECM-APL-E30-C1R(0~+60C) 3.5" W/E3930/5USB/6COM/2LAN/C1 ECM-APL-E50W-C1R(Wide temp.-40~+85C) 3.5" W/E3950/5USB/6COM/2LAN/C1 ECM-APL-E40W-C1R(Wide temp.-40~+85C) 3.5" W/E3940/5USB/6COM/2LAN/C1 ECM-APL-E30W-C1R(Wide temp.-40~+85C) 3.5" W/E3930/5USB/6COM/2LAN/C1Specifications
ystem Information Processor Intel Atom® x7-E3950 Processor (2M Cache, up to 2.00 GHz) Intel Atom® x5-E3940 Processor (2M Cache, up to 1.80 GHz) Intel Atom® x5-E3930 Processor (2M Cache, up to 1.80 GHz) Intel® Pentium® Processor N4200 (2M Cache, up to 2.50 GHz) Intel® Celeron® Processor N3350 (2M Cache, up to 2.40 GHz) Intel® Celeron® Processor J3455 (2M Cache, up to 2.30 GHz) Platform Controller Hub Apollo SoC integrated System Memory 1 x 204-Pin DDR3L 1600&1333MHz SO-DIMM,supports up to 8GB (Non-ECC) I/O Chipset EC(IT8528E), I-series CPU use EC (IT8528I) for WT BIOS Information AMI uEFI BIOS,128Mbit SPI Flash ROM Watchdog Timer H/W Reset, 1sec. ~ 65535sec. and 1sec./step H/W Status Monitor Monitoring System Temperature, Voltage and FAN Status with Auto Throttling Control Expansion Expansion 1 x Mini PCIe (for PCIe & USB2.0) 1 x M.2 (2242)B-Key Storage Storage 1 x M.2 support SATA/USB interface & with Micro SIM card connector for SSD/3G/4G Touch Screen Built-in Touch controller (optional) EETI ETP-CP-MER4485XRU 1 x 5-pin 2.54mm Pin Header I/O USB Port 1 x USB 2.0 4 x USB 3.0 COM Port 1 x RS-232/422/485 5 x RS-232 GPIO 1 x 8bit GPIO SIM Slot 1 x Micro SIM Card Slot SATA 1 x SATA3 MIO 1 x LPC 1 x SPI Display Graphic Chipset Intel® Apollo Lake SoC integrated Gen9 LP Graphics Spec. & Resolution 2 x HDMI: Max. Resolution 3840x2160 @ 30Hz 1 x LVDS: Max. Resolution 1920x1080 @ 60Hz Multiple Display Triple Display Audio Audio Codec Realtek ALC888S supports 5.1-CH Audio Interface Mic-In, Line-In, Line-Out Certifications Certification Information CE,FCC Class B Ethernet LAN Chipset 2 x Intel® I211AT Intel I210IT for WT Ethernet Interface 10/100/1000 Base-Tx GbE compatible LAN Port 2 x RJ-45 Mechanical & Environmental Operating Temperature 0°C ~ 60°C (32°F ~ 140°F)(N4200/N3350) -40°C ~ 85°C (-40°F ~ 185°F)(E3900 Series)(Optional for Wide Temperature Model) Storage Temperature -40°C ~ 75°C (-40°F ~ 167°F) Operating Humidity 40°C @ 95% Relative Humidity, Non-condensing Weight 0.44lbs (0.2kg) Power Requirement Typical 12/24Vdc (+12V ~ +26V ) Power Mode AT/ATX Dimension (L x W) 5.7" x 4" (146mm x 101mm) Software Support OS Information Win 10, Linux Ordering Information Ordering Information ECM-APL-N4200-C1R 3.5" W/N4200/5USB/6COM/2LAN/C1 ECM-APL-N3350-C1R 3.5" W/N3350/5USB/6COM/2LAN/C1 ECM-APL-J3455-C1R 3.5" W/J3455/5USB/6COM/2LAN/C1 ECM-APL-E50-C1R(0~+60C) 3.5" W/E3950/5USB/6COM/2LAN/C1 ECM-APL-E40-C1R(0~+60C) 3.5" W/E3940/5USB/6COM/2LAN/C1 ECM-APL-E30-C1R(0~+60C) 3.5" W/E3930/5USB/6COM/2LAN/C1 ECM-APL-E50W-C1R(Wide temp.-40~+85C) 3.5" W/E3950/5USB/6COM/2LAN/C1 ECM-APL-E40W-C1R(Wide temp.-40~+85C) 3.5" W/E3940/5USB/6COM/2LAN/C1 ECM-APL-E30W-C1R(Wide temp.-40~+85C) 3.5" W/E3930/5USB/6COM/2LAN/C1CONTACT US FOR VOLUME PRICING
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Avalue – ECM-ASL
Avalue - ECM-ASL
XProduct SKU: ECM-ASL-P
ECM-ASL Intel® Processor N97, Intel® Core™ i3-N305 Processor & Intel Atom® x7000RE series 3.5”Micro Module
The ECM-ASL, powered by an Intel® CPU and featuring up to 8 Gracemont cores, it tackles industrial demands with ease. This rugged design thrives in extremes, supporting a temperature range of 0°C to 60°C or -40°C to 85°C, depending on CPU configuration. Uninterrupted operation is ensured by its wide voltage range from 9VDC to 36VDC. It also offers unmatched connectivity options, including triple display support, dual 2.5GbE LAN ports, and M.2 expansion.Features
Onboard Intel® Processor N97, and Intel® Core™ i3-N305 Processor, Intel Atom® x7000RE series processors Bottom Layer Soldered Processor Triple Display, DP 1.4a, HDMI 2.0b, 1 x 2CH LVDS/eDP Dual Intel® Gigabit Ethernet, 2.5GbE Dual Expansion Slot, M.2 Key-B, M.2 Key-E DC in +9V ~ +36VCONTACT US FOR VOLUME PRICING
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Avalue – ECM-TGUC 11th Gen Intel® Core™ SoC i5/i3 BGA Processor 3.5” Micro Module
Avalue - ECM-TGUC 11th Gen Intel® Core™ SoC i5/i3 BGA Processor 3.5” Micro Module
XProduct SKU: ECM-TGUC
11th Gen Intel® Core™ SoC i5/i3 BGA Processor 3.5” Micro Module
Features
- Bottom Layer Soldered Processor - Single 260-pin SO-DIMM DRAM Socket, Max, Up to 32GB DDR4 3200MTs (non-ECC Supported) - Triple display, 2 x DP++, 1 x 2CH LVDS/1x eDP (Default LVDS) - Expansion Slot, M.2 Key-B, M.2 Key-E, M.2 Key-M - Dual Gigabit Ethernet, 1 x 2.5GbE, 1 x 1GbE - TPM - DC-Input, +12~+24VDCSpecifications
System Information
Processor Onboard 11th Gen. Intel® Core™ SoC i5/i3 BGA Processor Intel® Core™ i3-1115G4 (up to 4.1GHz, dual-core, 6M Cache, TDP: 28/15W) Intel® Core™ i5-1135G7 (up to 4.2GHz, quad-core, 8M Cache, TDP: 28/15W) System Memory Single 260-pin DDR4 SODIMM Socket, Supports Up to 32GB DDR4 3200MTs SDRAM (non ECC only) I/O Chipset NCT6126 BIOS Information AMI BIOS, 256Mbit SPI Flash ROM Watchdog Timer H/W Reset, 1sec. ~ 65535sec and 1sec. or 1min./step H/W Status Monitor CPU & system temperature monitoring Voltages monitoring TPM Onboard NuvoTon NPCT750AADYX support TPM 2.0, co lay Infineon SLB9670VQ2.0 & ???? Z32H330TC-SQN-755Expansion
Expansion 1 x M.2 Type M 2280 (with 1 x PCI-e Gen4 x4) 1 x M.2 Type B 3042/3052/2242 (with SATA and USB2.0, USB 3.0, with 1 x SIM card slot, support WWAN+GNSS or SSD) * Only supports one SIM card (co-lay 1 x 10pin FPC connector for uSIM card adapter) 3.8V for 5G 1 x M.2 Key E 2230 support WiFi module (1 x PCI-e x 1 & USB 2.0 Signal))Storage
Storage 1 x M.2 (Key-B, 3052) 1 x M.2 (Key-M, 2280) 1 x SATA IIII/O
USB Port 3 x USB 3.2 Gen 2x1 5 x USB 2.0 COM Port 1 x RS-232/422/485 5 x RS232 SATA 1 x SATA III DIO 1 x 2 x 6 pin, pitch 2.00mm connector for GPIO: 8 bits & +3.3S Level Other 2 x LANDisplay
Graphic Chipset Intel® Tiger Lake UP3 SoC Processor integrated Gen12 graphics Spec. & Resolution DP++ Max resolution 4096x2160@60Hz LVDS Max resolution 1920 x 1080 Dual channel 18/24-bits or 1x eDP 1920 x 1080@60Hz (2 Lanes), default LVDS Multiple Display Triple Display LVDS 1 x LVDS: 1920 x 1080 Dual channel 18/24-bits LVDS (Chrontel CH7513A-BF eDP to LVDS)Audio
Audio Codec RealTek ALC888S-VD2-GR Audio Interface Mic-In, Line-In, Line-Out in pin headerCertifications
Certification Information CE FCC Class BEthernet
LAN Chipset Intel® I219LM Gigabit Ethernet Intel® I225V Gigabit Ethernet Ethernet Interface 1 x 10/100/1000/2.5G Base-Tx GbE compatible 1 x 10/100/1000 Base-Tx GbE compatible LAN Port 2 x RJ-45Mechanical & Environmental
Operating Temperature Standard Temperature: 0°C ~ 60°C (-4~140°F) with 0.5m/s air flow Storage Temperature -40°C ~ 75°C (-40°F ~ 167°F) Operating Humidity 40°C @ 95% Relative Humidity, Non-condensing Weight 0.44lbs (0.2kg) Vibration Test 1.5Grms, IEC 60068-2-64, Random, 5 ~ 500Hz, 30min/Axis, 3 Axis Shock Test 10G, IEC 60068-2-27, Half Sine, 11ms, Z Axis Drop Test ISTA 2A, IEC-60068-2-32 Test : Ed, 1 Corner, 3 Edges, 6 Faces Power Requirement DC in +12V ~ +24V ACPI Single power ATX Support S0,S3, S4, S5 ACPI 5.0 Compliant Power Mode AT/ATX (Default Setting: AT) Dimension (L x W) 5.7" x 4" (146mm x 101mm)Software Support
OS Information Win 10 LinuxOrdering Information
Ordering Information ECM-TGUC-15-A1R, ECM-TGUC/i31115G4/1SATA/6COM/8USB/15W/A1 ECM-TGUC-35-A1R, ECM-TGUC/i51135G7/1SATA/6COM/8USB/15W/A1CONTACT US FOR VOLUME PRICING
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Avalue – imx8 sbc embeddded board
Avalue - imx8 sbc embeddded board
XProduct SKU: RSC-IMX8M
RSC-IMX8M is a 3.5-inch single-board computer that supports NXP® i.MX8M Quad ARM Cortex A53 Quad Core Up to 1.5GHz; Cortex-M4 core processor, providing an ultra-low power consumption with the TDP is less than 3.5W. Supports 2GB Onboard LPDDR4 Memory (expandable up to 4GB Max) for industry application, and 1GB Onboard LPDDR4 Memory (expandable up to 4GB Max) for consumer application. RSC-IMX8M is equipped with a wide array of I/O interfaces, including OTG USB 3.0 Type C (Data only), USB 3.0 Type-A, USB 3.0 Pin Header, HDMI, LVDS, and MIPI DSI, giving it high expandability. RSC-IMX8M also supports M.2 Key E Socket (For WIFI/BT), M.2 Key B Socket + SIM Socket (For LTE), Dual GLAN for multi-connection for IoT and AIOT related applications. RSC-IMX8M is providing Board Support Package (BSP) for Android 10 and Yocto Linux v2.5 operating systems to help customers quickly build Android and Linux solutions.
Features
NXP® i.MX8M Quad ARM Cortex A53 Quad Core Up to 1.5GHz; Cortex-M4 core processor System Memory 2GB RAM Storage Storage eMMC 8GB I/O USB Port OTG USB 3.0 Type C (Data only) USB 3.0 Type A USB 3.0 Pin Header COM Port Extend Board-1 (4 x RS232/485) Extend Board-2 (2 x RS232/485 , 1 x CAN Bus , 1 x GPIO) External I/O Connector 1 x USB 3.0 Type A(Vertical type) 2x RJ45 connector with indicate LED Industry Version:2pcs(Default) , Consumer Version:1pcs 1 x HDMI connector (Vertical type) 1 x USB 3.0 Type C 1 x Micro SD socket 1 x Hand Phone 1 x Reset 1 x Power LED (Green) Internal I/O Connector 1 x Front Panel connector 2 x MIPI CSI connector 1 x DC connector with lock Header 1 x TAG connector 1 x MIPI DSI connector 1 x LVDS connector 1 x Back Light connector 1 x I2C connector 1 x USB connector 1 x 2230 M.2 for WiFi/BT (PCIe& USB Channel) 1 x 3042 M.2 for 3G/4G Module (USB Only) 1 x SIM Socket connector 1 x 2x20P Header connector 1 x 1x2P Header (R) connector 1 x 1x2P Header (L) connector 1 x Line-Out Header with 12V out 1 x Mic-In Header connector Display Multiple Display Display (HDMI / LVDS / MIPI DSI) Certifications Certification Information CE FCC Class B Ethernet LAN Chipset LAN 1: Intel I210 LAN 2: AR8033 Ethernet Interface 2 x RJ45 Connectors for Dual Gigabit LAN Industry Version:2pcs(Default) Consumer Version:1pcs Mechanical & Environmental Operating Temperature Industry Operating temperature:-40~85 Degree (Default) Consumer Operating temperature:0~85 Degree Storage Temperature -40°C ~ 85°C Operating Humidity 0% ~ 90% Relative Humidity, Non-condensing Weight 0.16kg Power Requirement DC 12 ~ 24V Power Input Power Mode Terminal Block 2P power input connector Dimension (L x W) (146.05mm x 101.6mm) Software Support OS Information Linux Yocto Version 3.0 Android Version 10CONTACT US FOR VOLUME PRICING
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Avalue – Intel® Elkhart Lake 3.5” Micro Module
Avalue - Intel® Elkhart Lake 3.5” Micro Module
XProduct SKU: ECM-EHL
Bottom Layer Soldered Processor -Single DRAM Socket, Max, Up to 32GB DDR4 -Triple Display, DP 1.4a , HDMI 2.0b, eDP 1.3 -Dual Expansion Slot, M.2 Key-B, M.2 Key-E -Dual Intel® Gigabit Ethernet, 2.5GbE, 1GbE -Wide Temperature, -40°C ~ 85°C -Wide DC-Input, +9~36Vdc
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