Pioneering Physical AI Revolution
DEEPX develops breakthrough AI semiconductors that bring advanced intelligence directly to everyday devices. Founded in 2015, we create the world’s most power-efficient AI chips, enabling reliable 24/7 AI operation in battery-powered and resource-constrained environments.
With over 400 patents filed globally and products like the DX-M1 (25 TOPS) and DX-V3 (13 TOPS), we’re working with industry leaders including Hyundai Motors, POSCO DX, LGU+ and Baidu. Our technology spans smart cameras, autonomous systems, robotics and edge computing applications across the US, China, Taiwan and Europe, making AI accessible everywhere.
Watch this video to learn more:
Why DEEPX? Proven Reliability
DEEPX ensures unmatched reliability of your AI systems with lower power, heat and bill – lower TCO than even free chip.
1. Thermal Efficiency
AI semiconductors must operate within -25°C to 85°C for industrial deployment. DEEPX chips are the only solutions maintaining high performance while staying safely within this thermal envelope, ensuring consistent operation without thermal throttling in real-world edge environments.
2. GPU-Level of AI Accuracy
DEEPX maintains GPU-level AI accuracy using optimized Int-8 quantization instead of power-hungry FP32. While industry standards target <1% accuracy loss, competing chips often exceed this threshold. DEEPX consistently delivers reliable predictions you can trust.
3. Unmatched AI Performance
DEEPX delivers 240% higher performance than GPGPU(ResNet-50 benchmark) while achieving 20x better power efficiency (FPS/W). This exceptional performance-per-watt ensures consistent, reliable AI processing even in power-constrained environments without performance degradation.
4. Industry-Leading TCO
Each DX-M1 saves approximately 94% in electricity costs over five years compared to GPGPUs. Even if competitors offered chips for free, DX-M1 remains more economical due to dramatically reduced power and cooling infrastructure requirements – protecting your long-term investment.
