DFI offers a strong line up of System-on-Modules for edge-AI driven industrial environments.
New – QRB812 Open Standard SoM from DFI for Automation, Autonomous Mobile Robots (AMR), Robotics or Drones
The new QRB812 System-on-Module from DFI is based on the Qualcomm QRB5165 Processor. The Open Standard Module is a solderable system-on-module, optimised for rugged applications requiring vibration resistance and a compact form factor. Its modular design enhances cost efficiency, minimises footprint and allows for future interface expansion.
Features of the new QRB812 module include:
- Qualcomm QRB5165 Processor, 8x Kryo 585 2.84Ghz
- 8GB LPDDR5 memory down
- Dual Displays: 1 4-lane MIPI-DSI, 1 USB-C DP
- Multiple Expansion: 2 PCIe x2 (Gen3), 1 PCIe x1 (Gen3), 2 USB 3.1 Gen2, 6 MIPI-CSI
New – PTH9HM is the latest in the line up of COM-HPC modules, based on the Intel® Core™ Ultra 3 Series (Panther Lake)
COM-HPC (Computer-on-Module High Performance Computing) is an open standard overseen by PICMG that defines modular, high-end computer boards. Designed for edge servers and complex industrial systems, it handles massive data processing, fast networking and AI acceleration.
Features of the new PTH9HM include:
- Intel® Core™ Ultra Series 3 processors (Panther Lake)
- Dual Channel LPDDR5x- 8533 memory down UP to 64GB
- Multiple Displays: 2 DDI, 1 eDP
- Multiple Expansion: Up to 8 PCIe x1 (Gen4), 1 PCIe x4 (Gen5) or 1 PCIe x8 (Gen5, 484 sku only)
- Rich I/O: 2 Intel 2.5GbE, 3 USB 4.0, 2 USB 3.2
Contact Solsta Embedded to find out more.