Further to Intel’s announcement that it will no longer supply Next Unit of Compute (NUC) products, ASUS has secured a licence with Intel which will enable it to manufacture existing NUC hardware and create new NUC products around upcoming core devices.
Global technology solution provider ASUS will manufacture, sell and support the NUC 10th to 13th generations systems product line, and will develop future NUC systems designs.
ASUS’s expertise and track record delivering industry-leading mini PCs to customers make it ideally suited to continue driving innovation and growth in NUC systems products, and ASUS is committed to ensuring the excellent support and service that NUC systems customers expect.
We are delighted that this means the NUC brand will continue via our partnership with ASUS.
Please contact us to find out more about price and availability of ASUS NUC.
We’ll be exhibiting at Hardware Pioneers Max in London next week – where electronics, IoT connectivity and embedded systems converge.
Hardware Pioneers Max is the UK’s largest exhibition and conference dedicated to cutting-edge technologies, solutions and tools for innovation-driven engineering teams. We’re co-exhibiting with Digi International on stand 45, and Ronald “Ron” Singh will be presenting his IoT Data Analytics & Security workshop on July 13th at 11am in conference room 2.
Use the code VIP-PARTNER100 for your FREE ticket, and do come and say hi if you’re attending. We’ll be ready to discuss your IoT requirements and advise on our latest portfolio of IoT solutions.
At Hardware Pioneers Max you have the unique opportunity to meet with leading experts and suppliers who can help you learn faster, make better decisions and speed up your product development process.
Learn Gain actionable advice from the brightest minds in electronics and IoT on how to develop cutting-edge products. Get up to date with the latest trends and advancements in the sector, and learn how to avoid costly mistakes that can slow down your development process.
Connect Meet other pioneering technical leaders, product managers, engineers and entrepreneurs who are building the next generation of smart and connected products.
Do business and innovate Find the latest and greatest hardware and software tech to boost your development speed and out-innovate your competitors.
Silicon Labs is proud to present the fourth annual Works With – a virtual developer conference for building the skills needed to create impactful connected devices.
Works With – Where Innovation Meets Implementation
Works With 2023 brings you two days of technical sessions, keynotes, and expert-led panels covering the latest trends, tools, and design techniques for developers. This free, all-virtual event features more than 40 technical sessions specifically designed to bring together leading ecosystem partners, thought leaders, and Silicon Labs experts to dive deep into the technologies driving IoT.
This is your chance to learn from Silicon Labs experts, design partners and developers from around the world. Select the sessions that interest you to create your own personal agenda.
Wi-Fi Provides developers with the knowledge to integrate Wi-Fi into their applications while managing coexistence, designing for power and security requirements, as well as navigating emerging certification standards.
Matter Developers, manufacturers and brands driving the Matter standard forward will share the latest developments and insights for its future in the smart home and beyond.
Bluetooth Provides developers with the knowledge to integrate Bluetooth into their applications while managing coexistence, designing for power and security requirements, as well as navigating emerging certification standards.
AI/ML This year’s agenda features sessions on developing successful AI/ML applications, predictive learning techniques, and building ML into IoT applications with Silicon Labs components.
LPWAN Our Works With 2023 LPWAN track will include sessions on developing smart city and large-scale outdoor applications, advanced features to look for in sub-GHz networks, and more.
IoT Trends RF design is complex, with new technologies, techniques, and tools being introduced every day and our IoT Trends track will focus on topics ranging from security to machine learning.
Quectel Wireless Solutions, a global IoT solutions provider, has launched its latest Quectel FCM360W Wi-Fi and Bluetooth module, combining a high-performance processor with Wi-Fi 6 and Bluetooth 5.1 capabilities. With large memory including 512KB SRAM and 4MB of flash memory, the FCM360W is highly versatile, offering a blend of processing power, memory, connectivity and security.
The module features standard security features such as WPA-PSK, WPA2-PSK and WPA3-PSK security standards and provides 128-bit AES encryption for added security. The FCM360W supports multiple interfaces including UART, SPI, I2C, I2S, ADC and PWM alongside many low power consumption modes and keep-alive mechanisms, making it ideal for smart homes and industrial IoT (IIoT) use cases.
Quectel’s FCM360W module is offered in the LCC form factor with an ultra-compact package size of 25.5mm x 18.0mm x 3.2mm, providing great flexibility for developers. The module offers support for multiple interfaces across 19 GPIOs, allowing for multi-channel SSL connections and local caching of large amounts of data. This makes it ideal for use cases such as photovoltaic inverters, energy storage batteries and other smart devices that require long-term data monitoring and storage. Additionally, the module has an operating temperature range of -40°C to +85°C and comes with antenna options that include RF coaxial connector, external antenna pin or PCB antenna.
“We’re proud to launch the Quectel FCM360W to help enable a wide range of smart home and industrial IoT devices,” said Norbert Muhrer, President and CSO, Quectel Wireless Solutions. “By bringing together Wi-Fi 6 and Bluetooth 5.1 in a compact form factor yet with a high-performance processor and large memory, we’re providing greater choices and flexibility for developers and device OEMs. With added support of QuecOpen and its powerful processing capabilities and array of interface options, the FCM360W is an excellent option for developers looking for a compact, versatile, and secure module for their IoT devices.”
Avalue Technology Inc. has unveiled the latest EMX-R680P Mini-ITX motherboard, which features Intel® 12th/13th Gen Core™ i9/i7/i5/i3/Pentium® /Celeron® processors and supports LGA 1700 CPUs up to 125W.
With the rapid development of IoT-enabled systems and AI technology, the speed and smoothness of transmitting data from end devices to cloud data centres become ever more crucial. This new motherboard is designed for device expansion and high-speed data transmission, offering a wide range of CPU options and flexible expansion I/O interfaces. The EMX-R680P provides powerful support for AI data applications and the manufacturing industry.
As chipset performance improves and CPU options expand, this series of motherboards become more powerful. EMX-R680P is a compact computing system which features rich I/O interfaces with 2 DDR5 memory slots and PCIe expansion slots Gen 5.0, offers 4 high-speed Ethernet transmitting, 3 M.2 interfaces (2 of which are M-Key), 5 extended serial ports (2 x RS232/422/485, 3 x RS232), 8 high-speed USB ports, 4 expansion USB ports, 2 DP ports, 1 standard HDMI 2.1b (8K), and an LVDS or eDP.
The EMX-R680P also supports RAID 0,1 to ensure disk safety, making it highly suitable for applications that require high-speed data processing and storage, fast network connections and data transmission, as well as extensive device connectivity, such as data centres, cloud computing, network storage, high-speed network servers, and surveillance.
The EMX-R680P has a high-reliability industrial-grade motherboard design, making it the optimal choice for industries such as industrial automation, manufacturing, healthcare and finance.
Digi has expanded the Connect EZ range with the launch of the Connect EZ 8 and the Connect EZ 16/32, offering simple, secure, scalable, serial-over-network connectivity for critical equipment. Modernize your operational infrastructure with simple and secure serial communication over the network that boots in seconds, configures in minutes, and runs for years.
With expanded network connectivity and functionality for today’s applications, Digi Connect EZ is designed to meet the demands of a wide range of critical serial applications including connecting to automation, robotics control, centralized device management, data acquisition, pick-n’ pack connectivity applications, and much more.
Digi Connect EZ is a click-to-connect solution now with 1, 2, 4, 8, 16, or 32 serial ports, software-selectable for 232/422/485 communication, dual 10/100/1000 Ethernet, dual SPF+ support, as well as optional LTE and Wi-Fi features.
There is a growing need for antennas that can support new wireless technologies and the demands of the Internet of Things. Antenna efficiency, application and usage needs have become more complex as a result, posing considerable performance challenges to product designers and manufacturers.
Our Technical Director and antenna expert Richard Bethell has written an article for EPD&T magazine in which he looks at the challenges arising from modern antenna applications, and explains how working with us can help you to overcome them.
The need for energy efficiency is creating huge demand for sensors, as we become ever more proactive in terms of monitoring our environments intelligently and making best use of both predictive and preventative maintenance, at home and in the workplace.
In this article in New Electronics, our Embedded Solutions Product Manager John Fitzpatrick explores the role of sensors in the quest to improve energy efficiencies, and the trends contributing to their continuing importance.
We’ve updated our Case Studies page, adding some recent examples of successful collaboration with customers in the very diverse applications of ultrasound scanning, waste and recycling, and railway monitoring systems.
For more details please visit the individual case study overviews:
Intelligent Ultrasound is an Oxfordshire-based company using proprietary AI technology to improve ultrasound scanning efficiency. We provided them with a custom medical PC, with medical certification for the UK, Europe and the USA. They needed a powerful PC to accommodate a plug-in ultrasound probe and two accessory mPCIe fast graphics cards within a small footprint.
Journeo’s innovation and forward-thinking approach have brought the IoT to the railway network, and Digi’s expertise in IoT connectivity, particularly around transport solutions, positions them as the perfect technology partner. The challenge was much more than just supplying connectivity hardware, and we knew that we could help to design a scalable and manageable system which could harness the capabilities of the IoT.
AMCS worked with Solid State Supplies to develop an automotive grade PC to fit inside the cab of waste and recycling collection vehicles. The hardware spec covered everything from the processor capability, the memory size and storage devices, down to the hardware interfaces on the PC itself. One of the important factors was being able to quickly install and remove the PC, and a custom chassis was developed allowing the PC to be installed in seconds. It was also really important that the PC could be hidden from view to deter thieves, as well as meeting environmental, system, connectivity and reliability requirements.
We’ve just published a whitepaper in which we examine trends and the drivers for growth in the infrared sensor market.
With input from our partners Excelitas Technologies and TE, we explore the impact infrared sensors are having on different markets including the health and wellbeing market, smart home market and street lighting market, with a foreward and conclusion from our Managing Director John Macmichael.
