Wire bonding is a critical yet often overlooked process in electronics manufacturing, and plays an indispensable role in shaping the devices we rely on today.
In this new article just published in New Electronics, Kit Moore takes a closer look at the evolution of this unsung hero and explores how advancements in wire bonding are pushing the boundaries of what’s possible in electronics.
Kit is Lead Process Engineer at our design and manufacturing centre based in Weymouth, Dorset.
Read the full article below:
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