| Features |  |  |  |  |  |
|---|---|---|---|---|---|
| Part Number | ACS10-TGU-A1-1R | ACS10-TGU-A1-2R | AIB-NW01 | ECS-APCL-3455-B1R | EMS-EHL |
| Description | 11th Gen Intel® Core™ i5/i3 Tiger Lake-UP3 ProcessorIntel® Iris® Xe/ UHD Graphics Engine1-260-pin DDR4 3200MHz SO-DIMM, Supports Up to 32GB2-Gigabit Ethernet, 1 x 2.5GbE, 1 x 1GbE2-COM Port (RS-232/422/485 & RS-232)2-Audio Jack (Line-Out & Mic-In)2-Storage (M.2 Key-M NVMe & M.2 Key-B SATA)2-Expansion Slot (M.2 Key-E, Key-B)6-USB Port (3-USB 3.2 & 3-USB 2.0)CE, FCC Class A, UKCA | 11th Gen Intel® Core™ i5/i3 Tiger Lake-UP3 ProcessorIntel® Iris® Xe/ UHD Graphics Engine1-260-pin DDR4 3200MHz SO-DIMM, Supports Up to 32GB2-Gigabit Ethernet, 1 x 2.5GbE, 1 x 1GbE2-COM Port (RS-232/422/485 & RS-232)2-Audio Jack (Line-Out & Mic-In)2-Storage (M.2 Key-M NVMe & M.2 Key-B SATA)2-Expansion Slot (M.2 Key-E, Key-B)6-USB Port (3-USB 3.2 & 3-USB 2.0)CE, FCC Class A, UKCA | Compatible with NVIDIA® Orin NX & Orin NanoHigh AI computing performance for GPU-accelerated processingIdeal for intelligent edge applicationsSupport M.2 2242/2280 NVMe SSDSupport M.2 3042/3052 5G moduleSupport M.2 2230 WIFI/BT module4 x USB3.1 Type A / 2 x Gigabit LAN / 2 x COM / 1 x HDMISupport wide temperature environment | 1 x 204-pin DDR3L1600/1333MHz SO-DIMM socket, supports up to 8GB, 4GB installed as default.2 x USB 3.0, 2 x USB 2.01 x DP++, 1 x HDMI (Dual Display)1 x M.2 Type B 3042/2242/2260 supports SSD, 64GB installed as default.1 x M.2 Type A 2230 supports WiFi module2 x Intel i211AT Gigabit Ethernet2 x SMA connector (optional)60W Adapter (DC in 12V@5A) | On board Intel® Celeron®/Atom™ J6413/x6425E SoC BGA Processor1 x 260-pin SODIMM socket Max. up to 32GB DDR4 3200MT/sRich I/O, 4-USB3.2, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO. Support 5G (Sub-6G) module, HDMI 2.0b (4K @ 60Hz), LAN 2.5G Base-Tx GbE Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 65°C (ST)CE, FCC Class B, LVD 62368-1, IP50 Wide range DC power input from +9~36VSupport HW TPM 2.0 Support IET modules |
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| Features |  |  |  |  |  |
|---|---|---|---|---|---|
| Part Number | EMS-EHL-6LAN | EMS-TGL | EMS-TGL-4COM | EMS-TGL-6COM | EMS-TGL-6LAN |
| Description | On board Intel® Celeron® J6413 / Atom™ x6425E SoC BGA Processor1 x 260-pin SODIMM socket Max. up to 32GB DDR4 3200MT/sRich I/O, 4-USB3.2, 2-USB2.0, 1-DP, 1-HDMI, 2-COM, 6-LAN, 1-8bit GPIOSupport 4 ports LAN Bypass function (w/ IET-6LAN Bypass) Support 5G (Sub-6G) module, HDMI 2.0b (4K @ 60Hz), LAN 2.5G Base-Tx GbE Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 65°C (ST)CE, FCC Class B, LVD 62368-1, IP50 Wide range DC power input from +9~36VSupport HW TPM 2.0 Support IET modules | On board 11th Gen. Intel® Core™ i7/i5/i3 BGA Processor2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/sRich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO. Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G Base-Tx GbE Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)CE, FCC Class B, IP50 Wide range DC power input from +9~36VSupport HW TPM 2.0 | On board 11th Gen. Intel® Core™ i7/i5/i3 BGA Processor2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/sRich I/O, 4-USB3.1, 2-USB2.0, 1-DP, 1-HDMI, 6-COM (4COM w/2.5KV isolation), 2-LAN, 1-8bit GPIO. Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G Base-Tx GbE Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)CE, FCC Class B, IP50 Wide range DC power input from +9~36VSupport HW TPM 2.0 | On board 11th Gen. Intel® Core™ i7/i5/i3 BGA Processor2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/sRich I/O, 4-USB3.1, 2-USB2.0, 1-DP, 1-HDMI, 6-COM, 2-LAN, 1-8bit GPIO. Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G Base-Tx GbE Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)CE, FCC Class B, IP50 Wide range DC power input from +9~36VSupport HW TPM 2.0 | On board 11th Gen. Intel® Core™ i7/i5/i3 BGA Processor2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/sRich I/O, 4-USB3.1, 2-USB2.0, 1-DP, 1-HDMI, 2-COM, 6-LAN, 1-8bit GPIO.Support 4 ports Bypass function. (w/ IET-6LAN Bypass) Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G Base-Tx GbE Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)CE, FCC Class B, IP50 Wide range DC power input from +9~36VSupport HW TPM 2.0 |
| Supplier | Avalue Technologies | Avalue Technologies | Avalue Technologies | Avalue Technologies | Avalue Technologies |
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| Features |  |  |  |  |  |
|---|---|---|---|---|---|
| Part Number | EMS-TGL-DVI | EMS-TGL-HDMI | EMS-TGL-PSE | EMS-TGL-USB | EPC-APL-33-C2-1R |
| Description | On board 11th Gen. Intel® Core™ i7/i5/i3 BGA Processor2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/sRich I/O, 4-USB3.1, 2-USB2.0, 1-DP, 1-HDMI, 1-DVI-D, 2-COM, 2-LAN, 1-8bit GPIO. Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G Base-Tx GbE Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)CE, FCC Class B, IP50 Wide range DC power input from +9~36VSupport HW TPM 2.0 | On board 11th Gen. Intel® Core™ i7/i5/i3 BGA Processor2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/sRich I/O, 4-USB3.1, 2-USB2.0, 1-DP, 2-HDMI, 4-COM, 4-LAN, 1-8bit GPIO. Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G Base-Tx GbE Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)CE, FCC Class B, IP50 Wide range DC power input from +9~36VSupport HW TPM 2.0 | On board 11th Gen. Intel® Core™ i7/i5/i3 BGA Processor2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/sRich I/O, 4-USB3.1, 2-USB2.0, 1-DP, 1-HDMI, 2-COM, 2-LAN, 4-PoE(af/at),1-8bit GPIO. Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G Base-Tx GbE Fanless operation temperature from -40°C ~ 60°C (WT) / 0°C ~ 60°C (ST)CE, FCC Class A, IP50 Wide range DC power input from +9~36VSupport HW TPM 2.0 | On board 11th Gen. Intel® Core™ i7/i5/i3 BGA Processor2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/sRich I/O, 8-USB3.1, 3-USB2.0, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO. Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G Base-Tx GbE Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)CE, FCC Class B, IP50 Wide range DC power input from +9~36VSupport HW TPM 2.0 | Intel® Apollo Lake Processor N3350 Single DRAM Socket, Max. Up to 8GB DDR3L 1866MHzRich I/O, 1-VGA, 1-COM, 2-HDMI, 2-LAN, 4-USB3.0, 2-Antennal MountingFanless Operating from -10°C ~ 50°CWide Range DC Power Input from 12V ~ 26VCompact Size, 177mm x 123mm x 43.5mmOptional VESA / DIN-Rail KitTPM 2.0 |
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| Datasheet | Download | Download | Download | Download | Download |
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| Features |  |  |  |  |  |
|---|---|---|---|---|---|
| Part Number | EPC-APL-34-C2-1R | EPC-APL-42-C2-1R | EPC-EHL-8COM | EPC-EHL-X13-B1-1R | EPC-EHL-X13-B1-4R |
| Description | Intel® Apollo Lake Processor J3455 Single DRAM Socket, Max. Up to 8GB DDR3L 1866MHzRich I/O, 1-VGA, 1-COM, 2-HDMI, 2-LAN, 4-USB3.0, 2-Antennal MountingFanless Operating from -10°C ~ 50°CWide Range DC Power Input from 12V ~ 26VCompact Size, 177mm x 123mm x 43.5mmOptional VESA / DIN-Rail KitTPM 2.0 | Intel® Apollo Lake Processor N4200 Single DRAM Socket, Max. Up to 8GB DDR3L 1866MHzRich I/O, 1-VGA, 1-COM, 2-HDMI, 2-LAN, 4-USB3.0, 2-Antennal MountingFanless Operating from -10°C ~ 50°CWide Range DC Power Input from 12V ~ 26VCompact Size, 177mm x 123mm x 43.5mmOptional VESA / DIN-Rail KitTPM 2.0 | Intel® Elkhart Lake Processor x6413EIntel® UHD Graphics, Max. Up to 32EU1-Memory Socket, Max. Up to 32GB DDR4 3200Rich I/O, 4-USB, 1-HDMI, 1-DP, 2-LAN, 8-RS232, 1-Mic-in, 1-Line-out2-M.2, Key-E/B for Wi-Fi, LTE, SSD, I/O moduleFanless Operating Temp, -40 ~ 70°CWide Range DC Power Input, +9V~36VDefault dTPM 2.0, Wall Mount Kit | Intel® Elkhart Lake Processor x6413EIntel® UHD Graphics, Max. Up to 32EU1-Memory Socket, Max. Up to 32GB DDR4 3200Rich I/O, 4-USB, 1-HDMI, 1-DP, 2-LAN, 4-RS232, 1-Mic-in, 1-Line-out2-M.2, Key-E/B for Wi-Fi, LTE, SSD, I/O moduleFanless Operating Temp, -40 ~ 70°CWide Range DC Power Input, +9V~36VDefault dTPM 2.0, Wall Mount Kit | Intel® Elkhart Lake Processor x6413EIntel® UHD Graphics, Max. Up to 32EU1-Memory Socket, Max. Up to 32GB DDR4 3200Rich I/O, 8-USB, 1-HDMI, 1-DP, 2-LAN, 4-RS232, 1-Mic-in, 1-Line-out2-M.2, Key-E/B for Wi-Fi, LTE, SSD, I/O moduleFanless Operating Temp, -40 ~ 70°CWide Range DC Power Input, +9V~36VDefault dTPM 2.0, Wall Mount Kit |
| Supplier | Avalue Technologies | Avalue Technologies | Avalue Technologies | Avalue Technologies | Avalue Technologies |
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| Features |  |  |  |  |  |
|---|---|---|---|---|---|
| Part Number | EPC-EHL-X13-B1-5R | EPC-TGU-85-B1-1R | EPC-WHL-86-C2-1R | EPS-ADS | VMS-APL |
| Description | Intel® Elkhart Lake Processor x6413EIntel® UHD Graphics, Max. Up to 32EU1-Memory Socket, Max. Up to 32GB DDR4 3200Rich I/O, 4-USB, 1-HDMI, 1-DP, 4-LAN, 2-RS232, 1-Mic-in, 1-Line-out2-M.2, Key-E/B for Wi-Fi, LTE, SSD, I/O moduleFanless Operating Temp, -40 ~ 70°CWide Range DC Power Input, +9V~36VDefault dTPM 2.0, Wall Mount Kit | Intel® 11th Tiger Lake-U ProcessorIntel® Iris® Xe/UHD GraphicsSingle Memory Socket, Max. Up to 32GB DDR4 3200MT/sDual Display, DP++ 1.4Dual Intel® Gigabit Ethernet, Dual 2.5GbETriple Storage, 2.5” Drive Bay, 2-M.2 SSDTriple M.2 Slot, Key-E/B/M for Wi-Fi, LTE, SSD and I/O moduleSupport iAMT, SATA RAID 0/1Default dTPM 2.0, Wall Mount Kit | 8th Gen Intel® Whiskey Lake-U 4 Core Ultra Low 15W ProcessorIntel® UHD Graphics 620/610Dual Gigabit Ethernet, HD AudioDual Channel Max up to 64GB DDR4 2400MhzDual Expansion, M.2 Key-B/EDual HDMI w/CEC Controller (Factory Option)TPM 2.0, RAID 0/1Support VESA (Factory Option) | Intel® 12th Gen Core™ i9/i7/i5/i3/Pentium®/Celeron® ProcessorSupport H610E/Q670E2-DIMM Up to 64GB Dual Channel DDR5 SO-DIMM 4800MHz3-Storage (2.5” Drive Bay & 2-M.2 B/M)3-Expansion (mPCIe & 2-M.2 E/B)Rich I/O 8-USB, 6-COM, 2-LANSupport 5G, Wi-Fi 6E, 2.5G LANDC in +12V~24V, wide voltageSupport HW TPM 2.0 | Intel® Pentium®/Celeron®/Atom™ ProcessorOne 204-pin SODIMM Socket Up to 8GB DDR3L 1866MHz SDRAMRich I/O, 1 DP, 1 LVDS, 1 DC-Out, 1 8-bit GPIO, 1 M.2 SSD, 1 SD Card, 1 2.5″ Swappable Drive Bay, 2 Line-out, 2 Mic-in, 2 LAN, 2 COM, 4 USB, 5 Antenna MountingOnboard u-box M8N concurrent GNS module (GPS/QZSS, GLONASS, BeiDou)Rugged Fanless Design Compliant with MIL-STD-810GPower Management and Low Voltage Protection DesignWake on RTC/SMS Via WWAN ModuleOptional CAN modules supports OBD II, SAE J1939 or J1708Wide Range DC Power Input from 9 ~ 36VFanless Operating from -20/40 ~ 70°CSupports TPM 1.2/2.0 (Factory Option), SD card(SD 3.0) |
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| Features |  |  |  | ||
|---|---|---|---|---|---|
| Part Number | VMS-CFS | VMS-CFS-M12 | VMS-CFS-PSE(RJ45) | ||
| Description | 8th/9th Generation Intel® Processors (6-Core/8-Core)Intel® Q370 Express ChipsetIntel® UHD Graphics 630/610Memory Max. Up to 64GB DDR4 2666mPCIe,M.2 Key-E, M.2 Key-B Expansion Slots-25~70/-40C~70C Operating Temperature9~36Vdc DC Input, with Vehicle Power ManagementSupport RAID 0/1/5/10, Firmware TPM 2.0, iATM 12.0CE, FCC, IP50, E Mark, ISO7637-2 Certified | 8th/9th Generation Intel® Processors (6-Core/8-Core)Intel® Q370 Express ChipsetIntel® UHD Graphics 630/610Memory Max. Up to 64GB DDR4 2666mPCIe,M.2 Key-E, M.2 Key-B Expansion Slots4 ports M12 PoE, support 802.3af-25~70/-40C~70C Operating Temperature9~36Vdc DC Input, with Vehicle Power ManagementSupport RAID 0/1/5/10, Firmware TPM 2.0, iATM 12.0CE, FCC, IP50, E Mark, ISO7637-2 Certified | 8th/9th Generation Intel® Processors (6-Core/8-Core)Intel® Q370 Express ChipsetIntel® UHD Graphics 630/610Memory Max. Up to 64GB DDR4 2666mPCIe,M.2 Key-E, M.2 Key-B Expansion Slots4 ports RJ45 PoE, support 802.3af-25~70/-40C~70C Operating Temperature9~36Vdc DC Input, with Vehicle Power ManagementSupport RAID 0/1/5/10, Firmware TPM 2.0, iATM 12.0CE, FCC, IP50, E Mark, ISO7637-2 Certified | ||
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